FOUP for One®

The "Front Opening Unified Pod for One" is the most advanced Single Wafer InterFace (SWIF) pod technology for 300 mm Semiconductor facilities.

Mainly characteristics:

•Individual box for 300mm wafer
•Frontal opening
•Wafer holding by the edges
•AMHS compatible
•Compatible with E103 tool interfacing systems
•Transportable / manually manipulated (3kg weight)
•Materials and design optimization to avoid any contamination
•Wafer electric path-to-ground provided by conductive polymer

Options:
•Total ESD protection (dissipative shell materials)
•RF Tag, bar code or stickers traceability available
•Top handling flange for OHT (optional)

SWAP

The "Single WAfer Pod" is the lightest and the easiest handling SWIF (Single Wafer Interface) box for 300mm logistics.

Mainly characteristics:

•Individual box for 300mm wafer
•Frontal opening
•Wafer holding by the edges
•Compatible with E103 tool interfacing systems
•Transportable / manually manipulated (3kg weight)
•Materials and design optimization to avoid any contamination
•Wafer electric path-to-ground provided by conductive polymer
•Multi-boxes stackability secured by locking system

Options:

•Total ESD protection (dissipative shell materials)
•RF Tag, bar code or stickers traceability available
•Inerted version (I-SWAP) purgeable carrier

LPA

The "Load Port Adapter" emulates a FOUP to allow FFO®/SWAP loading to automatic tool I/O station

Mainly characteristics:

•To lift the FFO® up to door opening latch key
•FOUP front side emulator
•Correct position sensor pad activation

Avalaible in two versions:

•One for the FFO® loading
•One for the SWAP loading