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Strong
background
2004
INCAM is acquired by 40-30, a leader in maintenance
and repair of industrial and scientific equipment
2002
FOUP for One® adopted by IBM Burlington
(USA)
FOUP for One® system qualification by
International SEMATECH
2000
Participation in the SEA - TTL2 program (INCAM boxes assessment
at SC300 Dresden)
Publication of E103 standard by SEMI (Semiconductor Equipment and
Material international): specs and requirements for tool maker equipment
to be compatible with the SWIF concept (Single Wafer InterFace)
1997
Setting up of INCAM Solutions company (Individual Nitrogen Conditioning
for Advanced Manufacturing): individual nitrogen conditioning for
advanced processes.
INCAM 200mm demonstrator qualified on the LETI platform (patent
registration)
1992
Single wafer isolation programme starts (concept patented)
1990
WAFEC (Wafer Air Flow Environment Container) prototypes qualified
at Leti Litho.Cell
1986
Leti R&D programme starts
Improved wafer isolation technology based on a localized air flow
concept (generic patents)
Manufacturing
Production
means
•Clean room manufacturing line
•Control of the plastic materials
•Molding tools
•Ultraclean laser welding assembly process
•Cleaning bench
High
expertises in ultraclean manufacturing
Cleaning tool
Laser welding tool
Strong
partnership
INCAM industrial partners:
•40-30 cleaning service facilities,
team of skillful operator
•Alcatel international sales and services support
INCAM R&D partners:
•Key development work has focused on R&D
projects in the framework of the MEDEA programme (European semiconductor
R&D programme) with key European IC makers.
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