Press Release |
July 22, 2002 08:08 |
The FFO is the First 300mm Single Wafer Handling Alternative for a Wide Range of Applications; SEMI E103-SWIF Compliant
Visit INCAM Solutions at SEMICON West, SF: Booth #3125 (Gateway Hall)
GRENOBLE, France, July 22 /PRNewswire/ --
INCAM Solutions, the pioneer in microenvironment technology, today announced that it has made volume shipments of its FOUP for One(R) (Front Opening Unified Pod for One) and 300mm Load Port Adapters to a major north American microelectronics manufacturer for use in its back-end probe area, in addition to front-end and development R&D areas. The company has required that SEMI 103 standard compliance tools be used in its 300mm manufacturing lines. SEMI 103 was created through the SEMI international standards program to set criteria for allowing manufacturers to use single and batch carriers on the same tool. INCAM's FOUP For One delivers on this requirement.
"The advent of INCAM's FOUP for One (FFO), provides the semiconductor industry with an alternative to the 25 wafer FOUP, said Claude Doche, chairman and CEO of INCAM Solutions. "It facilitates a fast turn-around -- becoming a completely flexible method of wafer processing and can be used in conjunction with 25 wafer FOUPS or as a complete stand-alone integrated solution to wafer handling. This shipment to a major semiconductor manufacturer confirms the semiconductor industry's interest in INCAM's wafer handling technology for 300mm manufacturing. We are committed to using our unique technology to ensure that our clients are successful in their 300mm programs."
The FOUP for One is the most advanced Single Wafer Interface (SWIF) pod technology for 300mm semiconductor facilities.
INCAM Solutions' SWIF pod is the "cornerstone" of a wide range of applications, from fab to fab transport, off line characterization to single wafer manufacturing. It is a unique and economical solution for strategic single wafer lots handling such as engineering, send-ahead, tool qualification, process qualification, rework, and parametric testing. In 300mm processing, the typical batch FOUP does not address these applications due to ergonomic restrictions and invasiveness to automation. "When a chip maker doesn't use INCAM's FOUP for One technology for this purpose, the company runs the risk of shrinking production throughput and filling its stockers with a huge number of empty FOUPs," added Doche.
The 300mm market continues to ramp up, and equipment makers are showing more and more interest at INCAM's technology. They are asked to make their tools compatible with the SWIF system and recent orders for the INCAM's SEMI E103 Tool Set up Kit are the direct result of that growing demand. INCAM's proactive involvement with the SEMI Standards committee ensures that its technology is appropriate for use by all companies that are developing 300mm tools.
About INCAM Solutions: INCAM Solutions spin-off from LETI, the French microelectronics R&D center, in 1997 and is headquartered in Grenoble, France. INCAM enjoys the support of 300mm advocates worldwide, including key 300mm IC players, and many R&D connections with institutes and international consortium. INCAM's products are based on a SWIF technology that has been extensively developed and studied since 1992. For more information, visit: www.incam-solutions.com.
SOURCE INCAM Solutions
CONTACT: Claude Doche, Chairman and CEO of INCAM Solutions (France), or +33-(0)-4-38-78-40-33, or claude.doche@incam-solutions; or Camille Darnaud of International PR Consulting (U.S.), Tel/Fax, +1-650-251-9066, or Camille@attglobal.net, for INCAM Solutions.